PackExpo
Chicago, USA - McCormick Place, Booth S-2501

PACK EXPO

Experience 18 innovative technological solutions showcased by ten Coesia companies and digitally interact with over 100 machines. Join us at Booth S-2501 to keep up with the latest innovations in packaging and industrial process solutions available worldwide. Our teams from Acma, Citus Kalix, Emmeci, FlexLink, GF, Hapa, MGS, Norden, R.A Jones, Volpak will welcome you. For more information discover more

ALLPACK MIAC